Heat exchangers are primarily used to cool electronic devices. A variety of high performance defense systems, including phase-array antennas and high bandwidth jammers would benefit from this technology.
Current state-of-the-art air-cooled heat exchangers utilize copper finned-heat sink arrays with integrated heat pipe structures and separate blowers. However, the performance of such systems is inadequate to dissipate powers > 1kW, prevalent in a variety of high performance systems. Also, they cannot achieve thermal resistances of 0.05 C/W due to constraints on size, weight, and power consumption, which is necessary for high performance systems. This heat exchanger design integrates the pump and heat exchanger into one unit, and with a volume of 4”x4”x4”. It can dissipate 1 kW and has an overall heat sink thermal resistance 4x lower (<0.05 C/W) than current state-of-the-art.
An active motion heat exchanger can cool electronic devices faster and with less power consumption than traditional air-cooled heat exchangers. The novelty in this design is combining the pump and heat exchanger into one unit, where the stacked plurality of bladed rotor plates draws air across the corresponding thermal stator plates, which act as finned surfaces, to achieve optimal heat transfer performance. This design completely eliminates traditional blowers, and uses the additional space to drastically increase heat transfer surface area to attain the lowest possible thermal resistances.
Minimizes power requirements
Increases heat transfer surface area
Minimizes thermal resistance