Active Motion Heat Exchanger

Technology #13195

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Heat exchangers and related methodsHeat exchangers and related methodsHeat exchangers and related methodsHeat exchangers and related methods
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Inventors
Professor John Brisson
Department of Mechanical Engineering, MIT
External Link (meche.mit.edu)
Professor Evelyn Wang
Department of Mechanical Engineering, MIT
External Link (drl.mit.edu)
Professor Jeffrey Lang
Department of Electrial Engineering and Computer Science, MIT
External Link (www.rle.mit.edu)
Stuart Jacobson
Department of Aeronautics and Astronautics, MIT
Matthew McCarthy
Department of Mechanical Engineering, MIT
Managed By
Christopher Noble
MIT Technology Licensing Officer - Clean and Renewable Energy
Patent Protection

Heat exchangers and related methods

US Patent 8,678,075
Publications
Characterization of a Condenser for a High Performance Multi-Condenser Loop Heat Pipe
ASME 2011 International Mechanical Engineering Congress and Exposition, Nov. 11–17, 2011
Development and Characterization of an Air-Cooled Loop Heat Pipe With a Wick in the Condenser
Journal of Thermal Science and Engineering Applications, Oct 25, 2013

Applications

Heat exchangers are primarily used to cool electronic devices. A variety of high performance defense systems, including phase-array antennas and high bandwidth jammers would benefit from this technology.

Problem Addressed

Current state-of-the-art air-cooled heat exchangers utilize copper finned-heat sink arrays with integrated heat pipe structures and separate blowers. However, the performance of such systems is inadequate to dissipate powers > 1kW, prevalent in a variety of high performance systems. Also, they cannot achieve thermal resistances of 0.05 C/W due to constraints on size, weight, and power consumption, which is necessary for high performance systems. This heat exchanger design integrates the pump and heat exchanger into one unit, and with a volume of 4”x4”x4”. It can dissipate 1 kW and has an overall heat sink thermal resistance 4x lower (<0.05 C/W) than current state-of-the-art.

Technology

An active motion heat exchanger can cool electronic devices faster and with less power consumption than traditional air-cooled heat exchangers. The novelty in this design is combining the pump and heat exchanger into one unit, where the stacked plurality of bladed rotor plates draws air across the corresponding thermal stator plates, which act as finned surfaces, to achieve optimal heat transfer performance. This design completely eliminates traditional blowers, and uses the additional space to drastically increase heat transfer surface area to attain the lowest possible thermal resistances.

Advantages

  • Minimizes power requirements
  • Increases heat transfer surface area
  • Minimizes thermal resistance