Silicon is an important and pervasive material in the field of electronics. However, there are no established methods for processing silicon into monodisperse spheres. The development of a versatile approach for controlled and scalable production of uniform silicon spheres would be an important breakthrough in the fields of mechanics, biotechnology, photonics and green energy. This invention provides a method.
The technology uses a silicon-in-silica fiber and a moving thermal gradient to induce capillary breakup in sub-micron fibers, resulting in the formation of monodisperse spheres. The processes allows for a continuous array of sphere of diameters less than 500 nanometers to be fabricated internal to the fiber. One application is to use this technology on P and N type silicon cores. The process creates spheres which can be fused into bi-spherical silicon “PN molecules” which have been experimentally verified to have formed PN junctions.
in terms of both size and number