Sleeved Coaxial Printed Circuit Board Via

Technology #16374

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Inventors
Glenn Brigham
Lincoln Laboratory, MIT
External Link (www.ll.mit.edu)
Bradley Perry
Lincoln Laboratory, MIT
External Link (www.ll.mit.edu)
Patrick Bell
Lincoln Laboratory, MIT
External Link (www.ll.mit.edu)
Richard Stanley
Lincoln Laboratory, MIT
External Link (www.ll.mit.edu)
Managed By
Dave Sossen
MIT Technology Licensing Officer
Patent Protection

Sleeved Coaxial Printed Circuit Board Vias

US Patent Pending US 2015-0014045

Sleeved Coaxial Printed Circuit Board Vias

US Patent Pending
Publications
Simulation and Research of the PCB Vias Effects
ICNC 2007. Third International Conference on Natural Computation, 5: 110-4, Aug. 24, 2007
Interactions between Vias and the PCB Power-Bus
2009 20th International Zurich Symposium on Electromagnetic Compatibility, 10478845: 257-60, Jan. 12, 2009

Applications

  • Electronic systems requiring:
  • High isolation, low cross talk multilayer laminated printed circuit boards
  • High dynamic frequency range electromagnetic (EM) transmissions
  • Frequency invariant EM transmissions
  • Cavity resonant critical designs and full duplex systems

Problem Addressed

Printed circuit boards (PCBs) have a top and bottom surface on which components may be affixed and a plurality of layers in between for carrying signals from one point to another. Signals beginning on one layer can move to another through vias and traces (conductive pathways for signal transmission). Due to current limitations, high frequency signals may emit EM radiation to the interior layers causing signal interference. In addition, impedance differences between signals and vias can cause undesirable reflections, affecting system performance.  

Technology

An improved PCB was designed and fabricated, boasting higher insolation between traces and greater frequency invariance. Using insolating materials, sleeved coaxial vias and a novel fabrication method, signal transmissions are isolated from each other. As a result, cross talk, undesirable reflections and EM transmission leakage to interior layers are reduced. The signals traces have proved capable of carrying signals above 1 GHz in frequency. In addition, the fabrication method results in better stepped notch cavity resonance suppression, reduced layer count through buffer layer removal and virtual shorting due to via placement under traces.

Advantages

  • Higher isolation between neighboring traces
  • Greater frequency invariance
  • Better stepped notch cavity resonance suppression
  • Reduced layer count through buffer layer removal
  • Virtual shorting via placement under trace