isolation, low cross talk multilayer laminated printed circuit boards
dynamic frequency range electromagnetic (EM) transmissions
invariant EM transmissions
resonant critical designs and full duplex systems
Printed circuit boards (PCBs) have a top and bottom surface on which components may be affixed and a plurality of layers in between for carrying signals from one point to another. Signals beginning on one layer can move to another through vias and traces (conductive pathways for signal transmission). Due to current limitations, high frequency signals may emit EM radiation to the interior layers causing signal interference. In addition, impedance differences between signals and vias can cause undesirable reflections, affecting system performance.
An improved PCB was designed and fabricated, boasting higher insolation between traces and greater frequency invariance. Using insolating materials, sleeved coaxial vias and a novel fabrication method, signal transmissions are isolated from each other. As a result, cross talk, undesirable reflections and EM transmission leakage to interior layers are reduced. The signals traces have proved capable of carrying signals above 1 GHz in frequency. In addition, the fabrication method results in better stepped notch cavity resonance suppression, reduced layer count through buffer layer removal and virtual shorting due to via placement under traces.
isolation between neighboring traces
stepped notch cavity resonance suppression
layer count through buffer layer removal
shorting via placement under trace