High-Signal-to-Noise Ratio, Low-cost Hyperspectral Imaging Method

Technology #17412

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Inventors
Professor Juejun Hu
Department of Materials Science and Engineering, MIT
External Link (web.mit.edu)
Professor Lionel Kimerling
Department of Materials Science and Engineering, MIT
External Link (photonics.mit.edu)
Anuradha Agarwal
Department of Materials Science and Engineering, MIT
Professor Kazumi Wada
Department of Materials Science and Engineering, MIT
Tian Gu
Department of Materials Science and Engineering, MIT
Managed By
Dave Sossen
MIT Technology Licensing Officer
Patent Protection

Methods and Apparatus for Spectral Imaging

PCT Patent Application WO 2016-086043

Applications

  • Surveillance
  • Remote sensing
  • Chemical and bio-molecular sensing
  • Spectroscopy
  • Food and petrochemical industry

Problems Addressed

Hyperspectral imaging (HSI) combines spatial images and spectral signatures for non-destructive, real-time material analysis and identification.  Conventional HSI is either performed by scanning systems or snapshot systems. While scanning systems suffer from low optical signal throughput, snapshot systems have poor spatial resolution and low signal-to-noise ratio.

Technology

This technology uses an imaging system comprising set of lenses, wave guiding structures, optical tuning system, and a photodetector pixel array to record multi-spectral images. The properties of the wave guiding structures are modified progressively by the tuning system with simultaneous capture of multiple images by the photodetector array. The spectrophotometric information contained in the captured images is extracted using an algorithm. The spatial decoupling between the focal plane of the optical parts and the photodetector array without opto-mechanical moving parts offers unique advantages including high signal-to-noise ratio that are not available in traditional HSI systems.

Advantages

  • Low cost
  • High spatial resolution
  • High signal-to-noise ratio
  • High system reliability and robustness
  • Sharp and improved image quality
  • Aberration-free imaging
  • Easy thermal management
  • Easily integrable with different cameras